Orders for EPC Gen2 tags, need to know what
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Due to the complexity of the Gen 2 smart label supply chain, EPC technology vendors, label suppliers, retailers and consumers are required to work closely together to benefit from the Gen 2 deployment.
Despite the close cooperation between retailers, consumer goods manufacturers and label suppliers in the “bar code era”, the “EPC Gen 2 era” requires a higher level of cooperation between them and EPC technology suppliers. To benefit from the deployment of Gen 2.
By researching and analyzing the design and manufacturing process of Gen 2 tag technology, retailers and consumers can leverage the vision and experience of major RFID companies to achieve efficient management of the supply chain, bringing the development of second-generation RFID technology to gold. era.
EPC Gen 2 label production cycle
A Gen 2 smart tag includes the following sections:
*Semiconductor wafer, processed in the chip, has enough data storage capacity to meet the requirements of EPC code;
* Antenna, made of conductive material, enables the chip to receive data from both the RFID reader and the data to the reader;
* substrate, the antenna is printed on the substrate, and the chip is also adhered to the substrate;
* Label panel that covers the RFID inlay and provides an easy-to-read printed area;
* Release the liner as the bottom layer of the inlay "sandwich";
* Adhesives, bonded inlays and panels, also bonded release liners and inlays, release liners and panels.
The first three parts make up the RFID inlay, which takes 10-14 weeks to manufacture. It is then shipped to the label processor in rolls, which in turn completes four to six steps in turn, requiring an additional one to three weeks. These steps mean that the production and shipping process takes 15-17 weeks. In order to meet the sudden increase in demand, it takes several months to adjust production and may result in out of stock. So, in short, familiarity with the Gen 2 RFID chip, inlay and label manufacturing process can help us better manage manufacturing time and delivery time.
Semiconductor manufacturing process
The entire process flow of an integrated circuit (IC) consists of 20 to 30 steps to locate transistors, wires, and all modules. In TI's newest clean room, people use the cutting-edge 130-nm process node technology to make Gen 2 usable ICs, which are faster than the old process node technology in producing smaller, stronger, more power-efficient high-capacity chips. fast.
Once the IC is ready, the inlay assembly process begins with the alignment of the bumps, which are typically 60-100 microns in diameter, and the printed landing pads adhere to the inlay. There is an electrical connection between each bump and bump, between the bump and the digital circuit, and the digital circuit forms the available IC for Gen-2. The bumps are protected by a high-strength epoxy to ensure good electrical conductivity.
Antenna design
When products containing EPC Gen 2 labels are shipped to retailers, they vary in size, shape, material and density. This difference in product may result in changes in the corresponding RF characteristics that can greatly affect the performance of the Gen 2 smart tag of the product or carton.
Designing, constructing, and testing a Gen 2 antenna takes a lot of time to achieve optimal configuration.
In order to respond to changes in the Gen 2 smart tag supply chain, inlay suppliers may offer three or more inlays. Technology vendors, including TI, may have to manufacture specific inlays and antennas to meet customer needs.
The steps involved in fabricating wafers in Gen 2 chips and designing a wide variety of antennas are complex. The more accurate semiconductor manufacturers and tag processors get from end users about their needs and forecasts, the better their ability to plan based on market needs.
Inlay scroll and package design
The next step in the Gen 2 smart label supply chain is to ship the inlays to the label processor in roll form. It is important that the label processor's existing embedded device is set to receive the product in the form of a volume. Carefully wrap the inlay on the reel to avoid damage, which is a key step in the final step of inlay production. The number of inlays on each reel is also accurately calculated to prevent the outer inlay from crushing the chip of the inner inlay.
Label package
To form the final RFID tag, the label processor inserts a flexible inlay containing the IC and etched metal or printed RFID antenna between the surface sheet of the label and the liner. After testing, the inlay and adhesive are bonded together and the adhesive is applied over the back of the pressure sensitive surface sheet. After inserting the inlay, the liner is again bonded to the surface sheet and die cut to the desired label size.
On time delivery
The final stage of the Gen 2 smart label supply chain is to accurately place the inlay in the label. This is very important because it will determine what end customers need to print on their labels. Because consumers and other manufacturers have a variety of products to install labels, they may need different types of labels.
Gen 2 smart labels are more complex to manufacture, sort and inventory than standard barcode-printable labels. Label processors create a wide variety of labels for different customer needs, and efficient management of inventory supply is a challenge for them. Currently, many label processors offer test equipment and services to ensure that EPC labels are matched to SKUs (stock units).
Due to the volatility and complexity of the Gen 2 smart label supply chain, members of the supply chain are required to carry out purposeful, innovative process development. The more semiconductor manufacturers, label processors and end customers communicate about real needs, the more cost-effective they will be, and the more efficient they will be to meet their needs.